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DZR-S Series Slotted Slicing dicing blade

DZR-S type scribing dicing blade is composed of nickel metal and diamond abrasive, featuring fast heat dissipation, good chip removal performance and excellent cutting performance.

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DZR-S Series Slotted Slicing dicing blade

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    • Commodity name: DZR-S Series Slotted Slicing dicing blade

    DZR-S type scribing dicing blade is composed of nickel metal and diamond abrasive, featuring fast heat dissipation, good chip removal performance and excellent cutting performance.

    DZR-S type scribing dicing blade is composed of nickel metal and diamond abrasive, featuring fast heat dissipation, good chip removal performance and excellent cutting performance.
    It can be widely used in cutting and processing of various hard and brittle materials and semiconductor package originals. Such as: PCB substrate, ceramic substrate and so on.
    The use of selected diamond abrasive, so that the scribing dicing blade has excellent cutting performance and long service life.
    The use of advanced manufacturing process can make the blade hardness, geometry, abrasive distribution to optimize. The control of diamond abrasive concentration and bonding agent effectively reduces the probability of burrs occurring during cutting.

Key words:

DZR-S Series Slotted Slicing dicing blade

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Weiteng Semiconductor
Weiteng Semiconductor
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WINTIME Semiconductor Technology Co., Ltd.

Telephone：+86-513-87886889

Mobile：+86-13851530812

E-mail:shenxiangfei@ntwintime.com

Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

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