Qualification Honor-WINTIME Semiconductor Technology Co., Ltd.

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Nantong WINTIME Semiconductor Technology Co., Ltd. has always attached great importance to technological innovation and intellectual property protection. Up to now, the company has 29 patent information, covering a variety of technologies and applications of wafer cutting blades. Among them, the company's independent research and development project "ultra-thin wafer dicing blade" has reached an ultra-thin thickness of less than 10 microns in process, and the product quality has reached the international first-class level. In addition, the company is actively applying for more patents to protect its technological achievements and core competitiveness.

10 microns

Ultra-thin thickness up to 10 microns

1 million pieces

Annual production of dicing blade

National Outstanding Entrepreneurship Program

Three-star cloud enterprises

High-tech enterprises

Award of Excellence in Advanced Manufacturing in the Sixth “China Wings of Entrepreneurship” Competition

"Entrepreneurship Jiangsu" and the Science and Technology Entrepreneurship Competition

Quality management system certification certificate

24/2000 The 11th China Innovation and Entrepreneurship Competition

Outstanding Enterprises of the 11th China Innovation and Entrepreneurship Competition (Growth Group)

Second prize in the Longhua District Innovation and Entrepreneurship Competition

The 11th China Innovation and Entrepreneurship Competition

Second Prize in the Growth Group at the National Finals of the 5th Tianjin University "Haitang Cup" Alumni Innovation and Entrepreneurship Competition.

"Chuangshang Jiangsu" Provincial Finals of the Innovation and Entrepreneurship Competition for College Graduates and Young Talents - Third Prize in the Project Competition

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WINTIME Semiconductor Technology Co., Ltd.

Telephone：+86-513-87886889

Mobile：+86-13851530812

E-mail:shenxiangfei@ntwintime.com

Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

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