Weiteng Semiconductor

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DZR Series Slicing dicing blad

DZR type scribing dicing blade is composed of metallic nickel and diamond abrasive, featuring ultra-thin and excellent cutting performance. It can groove and cut off various hard and brittle non-metals.
  • Description
    • Commodity name: DZR Series Slicing dicing blad

    DZR type scribing dicing blade is composed of metallic nickel and diamond abrasive, featuring ultra-thin and excellent cutting performance. It can groove and cut off various hard and brittle non-metals.

    DZR type scribing dicing blad is composed of metallic nickel and diamond abrasive, featuring ultra-thin and excellent cutting performance. It can slot and cut various hard and brittle non-metals.
    Such as: semiconductor wafers, functional ceramics, alloy materials, semiconductor packaging materials.
    The use of selected diamond abrasives gives the scribing dicing blade excellent cutting performance and long service life.
    The use of advanced manufacturing process of diamond abrasive concentration and bonding agent control, effectively reducing the probability of material chipping occurred during cutting.

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