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DZY series dicing blade

The DZY type adopts a unique process, integrating the cutting blade with the aluminum alloy flange to achieve higher precision. Capable of slotting and cutting various hard and brittle materials.

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DZY series dicing blade

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    • Commodity name: DZY series dicing blade

    The DZY type adopts a unique process, integrating the cutting blade with the aluminum alloy flange to achieve higher precision. Capable of slotting and cutting various hard and brittle materials.

    The DZY type adopts a unique process, integrating the cutting blade with the aluminum alloy flange to achieve higher precision. Capable of slotting and cutting various hard and brittle materials.
    For example, metal compound semiconductors such as silicon wafers and gallium arsenide.
    Using carefully selected diamond abrasives, the cutting blade has excellent cutting performance and a long service life.
    The use of advanced manufacturing processes to control the concentration of diamond abrasives and binders effectively reduces the probability of material edge breakage during cutting. Loading and unloading operations are more convenient.

Key words:

DZY series dicing blade

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Weiteng Semiconductor
Weiteng Semiconductor
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WINTIME Semiconductor Technology Co., Ltd.

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Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

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