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Cutting Plan
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Advanced Technology
The semiconductor industry is the main application field of wafer dicing blade, and its demand changes have an important impact on the development of the wafer dicing blade industry. With the rapid development of emerging technologies such as 5G, Internet of Things, and artificial intelligence, the demand for wafer dicing blade in the semiconductor industry will continue to grow, providing new development opportunities for the industry. Although international well-known brands such as DISCO and K & S occupy a large market share by virtue of their advantages in technology, brand and service, with the rapid development of the domestic semiconductor industry and technological progress, domestic substitution has become an important opportunity for the wafer dicing blade industry. Domestic enterprises have made breakthroughs in technology research and development, manufacturing, marketing and other aspects, and gradually have the strength to compete with international brands. By strengthening independent research and development, improving product quality and service level, domestic enterprises are expected to occupy a larger share in the future market.
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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