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Cutting Plan
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WINTIME Semiconductor Technology Co., Ltd.
WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.
WINTIME Semiconductor was founded in
Plant area
have patented technology
Technically achieve ultra-thin thickness within 9 microns
Leadership Concern
Investors from Hefei visit.
He Yijun, the Secretary of the Rugao Municipal Committee, visited the company for inspection.
Member of the Municipal Standing Committee and Vice Mayor, Secretary of the High-tech Zone, Chen Minghua.
The Director of the National People's Congress, Si Zhujian, came to conduct research.
Wang Minghao, the mayor of Rugao City, came to the company for a discussion.
Important clients are visiting the company for discussions.
Development History
Development History
2020
December 21st
A project team with Mr. Zhu Kaihua as the core member has been established. The company headquarters is located in Ruoqiao City,antong City, Jiangsu Province. It is a high-tech enterprise integrating the research and development, production, and sales of high-precision wafer-level cutting blades It specializes in providing supporting products and services for the precise cutting process in the semiconductor, optical communication, and new functional materials industries.
2021
Wintime Semiconductor Factory has settled in Rugao City and has begun in-depth technical research and development, as well as product production and application The company team has made significant breakthroughs in the fields of semiconductor equipment, materials, and processes, developing a high-precision ultra-thin wafer-level dicing, filling the domestic gap in the application of ultra-narrow cutting lanes on wafers.
2022
June 30th
Wintime Semiconductor completed a new round of equity financing, led by Yida Capital, with Zhonggao and Hefei Industrial Investment following up, raising tens of millions of yuan. The company continues to carry out product research and development and technological upgrades, among which theZY type dicing saw has achieved a thickness of less than 9 microns, and the product performance has reached the advanced level of foreign similar products.
November 18th
Wintime Semiconductor was selected as a high-tech enterprise for its performance in the field of technological innovation and was successfully listed on the provincial small and-sized enterprise platform.
2023
Wintime Semiconductor has reached nearly 100 employees, and the company has further expanded its international market, with the annual sales of its business exceeding ten million that year.
The Nantong Wintime Semiconductor Special Materials Project held a groundbreaking ceremony, with a planned total investment of 240 yuan, and the construction of 34,000 square meters of new factory buildings and ancillary buildings. It is expected that the project will be fully by 2026, with an annual output of 1 million pieces of wafer-level dicing saws.
2024
Wintime Semiconductor has achieved outstanding performance in terms of technological innovation, product research and development, and market application, realizing a doubling of performance for consecutive years; it has been awarded the honorary title of "Small and Medium-sized Innovative Enterprise"; in the same year, the new factory was put into use, with equipment and high-standard workshops as a guarantee, and with continuous high investment in research and development as a support, Wintime's dicing saw has embarked on a journey.
Corporate Culture
Enterprise Culture
Mission, Vision, Values
Mission
Concentrate on focus and continuous innovation, so that the infinite possibilities of semiconductor technology are within reach.
Vision
The most professional and trusted partner in the field of precision cutting.
Values
Work hard and live with love.
Administrative Area
WINTIME Office Area
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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