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    • Commodity name: Conductive silver paste

    Conductive silver paste is a key electronic material, mainly used in the electronics and semiconductor industries, with excellent conductivity and good printing adaptability. The following a detailed introduction to conductive silver paste:

    Basic composition:

    Conductive silver paste is mainly composed of silver powder, binder, solvent and other functional additives. Silver powder is the key component in conductive silver, and its purity and particle size directly affect the conductivity of the product. The binder is used to fix the silver powder on the surface of the substrate, while the helps the paste maintain appropriate fluidity during the printing process.

    Category:

    According to the application of conductive silver paste, it can be divided into electronic conductive silver paste and photoelectric conductive silver paste Electronic conductive silver paste is mainly used in the manufacturing of electronic devices, such as printed circuit boards (PCB), integrated circuits, internal electrodes of multilayer capacitors (MLCC), semiconductor packaging, etc., focusing more on the durability, adhesion, and process compatibility of the material. Photoelectric conductive silver paste mainly used in the field of high conductivity, high reliability, and fine grid line precision, such as solar cells, OLED display screen electrodes, photoelectric sensors, etcAccording to the sintering temperature, it can be divided into high-temperature silver paste, medium-temperature silver paste, and low-temperature silver paste. Lowtemperature silver paste has a sintering temperature of 150°C-500°C, which is suitable for low-temperature processing, and the substrate not easily damaged by heat, often used in flexible electronics and low-temperature substrates (such as plastics, glass). Medium-temperature silver paste has a sinter temperature of 500°C-800°C, which can have both high conductivity and moderate processing temperature, usually sintered in air, and the is relatively simple.According to the application of conductive silver paste, it can be divided into electronic conductive silver paste and photoelectric conductive silver paste Electronic conductive silver paste is mainly used in the manufacturing of electronic devices, such as printed circuit boards (PCB), integrated circuits, internal electrodes of multilayer capacitors (MLCC), semiconductor packaging, etc., focusing more on the durability, adhesion, and process compatibility of the material. Photoelectric conductive silver paste mainly used in the field of high conductivity, high reliability, and fine grid line precision, such as solar cells, OLED display screen electrodes, photoelectric sensors, etcAccording to the sintering temperature, it can be divided into high-temperature silver paste, medium-temperature silver paste, and low-temperature silver paste. Lowtemperature silver paste has a sintering temperature of 150°C-500°C, which is suitable for low-temperature processing, and the substrate not easily damaged by heat, often used in flexible electronics and low-temperature substrates (such as plastics, glass). Medium-temperature silver paste has a sinter temperature of 500°C-800°C, which can have both high conductivity and moderate processing temperature, usually sintered in air, and the is relatively simple.

    According to the type of substrate, conductive silver powder can be divided into metal-based silver paste, ceramic-based silver paste and flexible substrate silver paste Metal-based silver paste is suitable for metal substrates such as copper, aluminum and molybdenum, and it is necessary to consider the matching of the coefficient thermal expansion with the substrate, such as power module packaging. Ceramic-based silver paste is suitable for ceramic substrates such as alumina and aluminum nitride, and is to high-power electronic device substrates, electrodes and other products. Flexible substrate silver paste is suitable for flexible substrates such as PET and PI, and can be applied RFID, flexible electronics, touch screens and other fields.

    Application field:

    The application fields of conductive silver paste are extensive, including electronics, photovoltaics, etc. In the field of electronics, conductive paste has been developed as an interconnection material for power electronic packaging, and is used in LED packaging, power electronic fields, etc. In the photovoltaic field conductive silver paste plays a crucial role in the production of the front electrode of solar panels. Through precise printing, a conductive grid can be formed on the surface the silicon wafer, effectively collecting the current generated by photoelectric conversion. Due to its importance in the electronics and semiconductor industries, the development and innovation of conductive paste is of great significance for promoting the progress of related technologies.

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