Weiteng Semiconductor

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SZ Series Resin dicing blade

This grinding wheel blade is an ultra-precise cutting blade made of high-temperature-resistant resin powder and auxiliary added materials mixed and sintered with diamond. It is suitable for cutting semiconductor materials, ceramic materials, as well as glass, crystal, quartz and other materials.
  • Description
    • Commodity name: SZ Series Resin dicing blade

    This grinding wheel blade is an ultra-precise cutting blade made of high-temperature-resistant resin powder and auxiliary added materials mixed and sintered with diamond. It is suitable for cutting semiconductor materials, ceramic materials, as well as glass, crystal, quartz and other materials.

    This grinding wheel blade is an ultra-precise cutting blade made of high-temperature-resistant resin powder and auxiliary added materials mixed and sintered with diamond. It is suitable for cutting semiconductor materials, ceramic materials, as well as glass, crystal, quartz and other materials.

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