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Cutting Plan
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Great Achievements Soar, Setting Sail
Release time:
2022-06-30
Recently, Yida Capital led a financing round of tens of millions of yuan for Nantong Weiteng Semiconductor Technology Co., Ltd. (referred to as Weiteng Semiconductor).
Recently, Yida Capital led a financing round of tens of millions of yuan for Nantong Weiteng Semiconductor Technology Co., Ltd. (referred to as Weiteng Semiconductor).
Weiteng Semiconductor is a technology-driven enterprise specializing in providing tailored products and services for precision dicing processes in the semiconductor, optical communications, and advanced functional materials industries. Its flagship product is high-precision dicing blades.
Dicing blades are critical tools for wafer slicing and chip fabrication. Driven by trends toward miniaturization, higher capacity, and greater efficiency, the internal structures of chips are becoming increasingly complex, while the available space between chips is shrinking. As a result, wafer dicing directly impacts chip quality and lifespan, leading to continuously rising technological demands for dicing blades.
The core team at Weiteng Semiconductor has devoted years to research in the field of precision dicing. The company’s high‑precision dicing blades boast an excellent design, exceptional cutting accuracy, stable performance, and a long service life, with key metrics such as blade thickness and lifespan reaching domestically leading levels. Leading companies in the downstream packaging and testing sector have already completed product testing and initiated partial volume‑based adoption.
Dicing, as one of the core processes in semiconductor packaging and testing, continues to drive steady growth in demand for dicing blades. With this round of financing, Weiteng Semiconductor will further expand its production capacity to meet market demand.
The investor said.
Liu Feng, a partner at Yida Capital, stated that China has long relied on imports for critical products in high‑end semiconductor equipment and materials. For dicing blades used in the semiconductor industry, the domestic production rate is less than 10%, and the share of domestically produced wafer‑level dicing blades is even lower. After years of R&D, the Weiteng Semiconductor team has mastered a complete technological roadmap spanning equipment, materials, and processes, developing high‑precision, ultra‑thin wafer‑level dicing blades that have achieved domestic production and are now being delivered in volume. We look forward to Weiteng Semiconductor continuing to elevate its product technology and further meet the urgent demand for dicing blades across the semiconductor and optical communications industries.
*Disclaimer: Weiteng Semiconductor has republished this content from the “Yida Capital” official account. If any part of the content infringes upon your rights, please contact us for removal. (WeChat number: 17688812368)
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Weiteng Semiconductor
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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