Weiteng Semiconductor

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“Electroformed Hard Tool” Enables 9-Micron High-Precision Cutting; Weiteng Semiconductor Wins the “Annual Technology Breakthrough Award”


Release time:

2025-12-22

On December 20, 2025, the “2026 Semiconductor Investment Annual Conference and IC Leaders Awards Ceremony,” co-hosted by the Semiconductor Investment Alliance and the Integrated Circuit Investment Innovation Alliance, with support from the ICT Intellectual Property Development Alliance and organized by iJiwei, was grandly held in Shanghai. Nantong Weiteng Semiconductor Technology Co., Ltd. (hereinafter referred to as Weiteng Semiconductor) was honored with the Annual Technology Breakthrough Award.

This award is intended to recognize groundbreaking, significant technological innovations in cutting-edge fields that were achieved in 2025 and have reached international standards. At an advanced/leading level, it may yield significant economic and social benefits in the future, playing a crucial role in advancing the independent, secure, and controllable development of China’s integrated circuit industry chain. A company of great significance. The organizing committee evaluated candidates across three dimensions: the originality of the technology, the key performance metrics and specifications of the technology or product, and the product’s market prospects and socio-economic benefits. Ultimately, Weiteng Semiconductor stood out among numerous contenders to win this award.

Founded in 2020, Weiteng Semiconductor, From its very inception, it has shouldered a clear mission: to achieve domestic self-reliance and high-end substitution in the field of precision cutting, an area long dominated by international industry giants. The company integrates R&D, manufacturing, and sales, dedicated to providing customers with professional services that encompass high-precision cutting blades, cutting tapes, and end-to-end solutions, helping downstream enterprises enhance cutting quality and optimize production costs.

This strategic positioning quickly resonated with the market. In 2023, with the completion and commissioning of a semiconductor‑specific materials project totaling tens of millions of yuan in investment, Weiteng Semiconductor expanded its facilities to 34,000 square meters, including new production buildings and ancillary spaces. Its annual wafer‑dicing blade capacity surged to over one million units, elevating the company to a leading position nationwide. More significantly, the company has accumulated 31 patented technologies and achieved notable success in numerous national, provincial, and municipal science‑and‑technology and entrepreneurship competitions, firmly establishing its industry standing through innovative strength.

Core technology is the key weapon that enables Weiteng Semiconductor to break through. Its newly developed “ultra-thin wafer dicing blade” project has successfully reduced blade thickness to below 9 microns, with product quality reaching world‑class standards. As a result, Weiteng Semiconductor has become the first domestic company capable of mass‑producing ultra‑thin blades at this level, thereby breaking the technological monopoly held by foreign manufacturers.

Weiteng Semiconductor’s “Electroformed Hard-Tool” product series, for which it has submitted this award application, is a quintessential showcase of its technological prowess. This product series combines versatility with specialized performance: the general‑purpose models are compatible with a wide range of base materials, including silicon, ceramics, and glass, while the dedicated models are tailored to the unique dicing requirements of third‑generation compound semiconductors such as gallium arsenide. Notably, the DZY series employs a proprietary monolithic molding process that integrates the dicing blade with an aluminum alloy flange, delivering superior structural precision and stability, and enabling highly efficient, high‑precision grooving and cutting operations on a variety of hard, brittle materials.

The outstanding performance of Weiteng Semiconductor’s “electroformed hard cutting tools” stems from three core breakthroughs in materials science and manufacturing processes: Ultrafine grinding Material homogenization and dispersion technology, ultra-high-strength matrix material technology, and quantitative, controllable diamond exposure technology.

Weiteng Semiconductor’s product capabilities have been validated through direct comparisons with leading international competitors. Compared to the 10-micron minimum kerf width of blades from Japan’s industry leader, Disco, Weiteng Semiconductor’s blades can consistently achieve an even narrower 9-micron kerf, giving it a distinct advantage in terms of precision.

It is worth noting that Weiteng Semiconductor’s robust product capabilities have earned widespread market recognition. At present, Weiteng Semiconductor’s customer base spans the packaging and testing sectors, Optical communication It has become a trusted supplier to numerous leading domestic and international customers across multiple high-tech sectors, including smart healthcare and LED chips. This marks a significant milestone: its products have not only achieved domestic substitution but have also integrated into the global high-end semiconductor manufacturing ecosystem, delivering exceptional performance and reliability.

The IC Power List spotlights leading Chinese companies in the integrated circuit industry that demonstrate exceptional business acumen in the new era. Drawing on reliable, multi‑dimensional data from market trends, academia and research, investors, and brand reputation, and adhering to the principles of objectivity, transparency, and broad inclusiveness, the list rigorously selects each year’s outstanding individuals, institutions, enterprises, and brands through public solicitation, voluntary submissions, and expert evaluation. This process establishes industry benchmarks, illuminates the sector’s landscape, unleashes corporate innovation potential, and cultivates fertile ground for industrial advancement. With an open international perspective and scientifically sound selection criteria, the IC Power List empowers semiconductor firms to innovate, earning widespread recognition and favor from both businesses and the market, and has become a premier benchmark award in China’s IC industry. Looking ahead, the IC Power List will continue to serve as a guiding force, providing robust support and momentum for the high‑quality development of China’s semiconductor sector.

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