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Cutting Plan
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“Electroforming Hard Blades” Achieve 9-Micron High-Precision Cutting; Weiteng Semiconductor Wins “Annual Technology Breakthrough Award”
Release time:
2025-12-22
On December 20, 2025, the "2026 Semiconductor Investment Annual Conference & IC风云榜 Awards Ceremony," hosted by the Semiconductor Investment Alliance and the Integrated Circuit Investment Innovation Alliance, co-organized by the ICT Intellectual Property Development Alliance, and undertaken by Aijijiwei, was grandly held in Shanghai. Nantong Weiteng Semiconductor Technology Co., Ltd. (hereinafter referred to as "Weiteng Semiconductor") was awarded the Annual Technology Breakthrough Award.
This award aims to recognize groundbreaking, original technological innovations in cutting-edge fields that have been achieved in 2025 and meet international standards. Advanced/leading-edge level, with the potential to generate significant economic and social benefits in the future, playing a crucial role in promoting the independent, secure, and controllable development of China’s integrated circuit industry chain. A company making a significant impact. The organizing committee evaluated candidates based on three key aspects: the originality of the technology, the primary performance and metrics of the technology or product, and the product’s market prospects as well as its economic and social benefits. Ultimately, Weiteng Semiconductor stood out among numerous nominees and won this award.
Weiteng Semiconductor, founded in 2020, From its very inception, it has been entrusted with a clear mission: to achieve domestic self-reliance and high-end substitution in the field of high-precision cutting—a sector long dominated by international giants. The company integrates R&D, manufacturing, and sales, and is committed to providing customers with professional services that cover high-precision cutting blades, cutting tapes, and end-to-end solutions, helping downstream enterprises enhance cutting quality and optimize production costs.
This strategic positioning quickly resonated with the market. In 2023, with the completion and commissioning of a semiconductor-specific materials project involving total investments amounting to tens of millions of yuan, Weiteng Semiconductor constructed a new factory building and ancillary facilities totaling 34,000 square meters. Its annual production capacity for dicing blades surged to over 1 million units, placing it among the top players nationwide in terms of scale. Even more significantly, the company has accumulated a total of 31 patented technologies and has achieved outstanding results in numerous national, provincial, and municipal science and technology and entrepreneurship competitions, firmly establishing its industry-leading position through its innovative strength.
The core technology is the sharp edge that enables Weiteng Semiconductor to break through its market challenges. The company’s newly developed “ultra-thin wafer dicing blade” project has successfully reduced the blade thickness to below 9 micrometers, bringing product quality up to world-class standards. As a result, Weiteng Semiconductor has become the first domestic enterprise capable of mass-producing ultra-thin blades at this level, thereby breaking the technological monopoly held by foreign manufacturers.
The “Electroforming Hard Blades” product series, for which Weiteng Semiconductor is submitting an award nomination this time, is a prime embodiment of its technological prowess. This product series features a design that balances versatility and specialization: the universal models are compatible with a variety of base materials, including silicon, ceramics, and glass; while the specialized models are tailored to meet the unique cutting requirements of third-generation compound semiconductors such as gallium arsenide. Among them, the DZY model employs a distinctive integrated molding process that combines the dicing blade with an aluminum alloy flange into a single unit, achieving higher structural precision and stability. This enables efficient and precise grooving and cutting operations on a wide range of hard and brittle materials.
The outstanding performance of Weiteng Semiconductor’s “electroformed hard cutting tools” stems from three core breakthroughs in materials science and manufacturing processes: Ultrafine grinding Material homogenization and dispersion technology, ultra-high-strength matrix material technology, and quantitative, controllable diamond exposure technology.
Weiteng Semiconductor’s product strength has been validated through direct comparisons with leading international peers. Compared to the narrowest cutting width of 10 micrometers achieved by the blades of Japan’s industry leader, Disco, Weiteng Semiconductor’s blades can now consistently achieve an even narrower cutting width of 9 micrometers, giving them a clear advantage in terms of precision.
It is worth noting that Weiteng Semiconductor’s outstanding product capabilities have earned widespread market recognition. Currently, Weiteng Semiconductor’s customer network covers packaging and testing, Optical communication Key enterprises in multiple high-tech fields—including smart healthcare and LED chips—have become trusted suppliers for numerous leading domestic and international clients. This marks not only the localization and substitution of their products but also their integration into the global high-end semiconductor manufacturing ecosystem thanks to their superior performance and high reliability.
The IC Fengyun List focuses on outstanding Chinese integrated circuit enterprises that demonstrate business acumen in the context of the new era. Based on reliable data from multiple dimensions—including market performance, academic research, investment circles, and brand reputation—and guided by the principles of objectivity, authenticity, fairness, openness, and broad inclusiveness, the list is rigorously selected through a process involving public solicitation, voluntary submissions, and expert evaluation. This process identifies and honors the industry’s top individuals, institutions, companies, and brands of the year, setting industry benchmarks, showcasing the overall landscape of the sector, stimulating corporate innovation potential, and fostering a fertile ground for industrial innovation. With an open international perspective and scientifically sound selection criteria, the IC Fengyun List empowers semiconductor companies to drive innovation and has earned widespread recognition and acclaim from both businesses and the market, emerging as a leading benchmark award for China’s IC industry. Looking ahead, the IC Fengyun List will continue to play its role as a guiding beacon, providing robust support and impetus for the high-quality development of China’s semiconductor industry.
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Weiteng Semiconductor
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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