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Cutting Plan
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“Electroforming Hard Cutting Tools” Achieve 9-Micron High-Precision Cutting; Weiteng Semiconductor Wins “Annual Technology Breakthrough Award”
Release time:
2025-12-22
On December 20, 2025, the “2026 Semiconductor Investment Annual Conference and IC Influencer Awards Ceremony,” hosted by the Semiconductor Investment Alliance and the Integrated Circuit Investment Innovation Alliance, co-organized by the ICT Intellectual Property Development Alliance, and undertaken by iChip, was grandly held in Shanghai. Nantong Weiteng Semiconductor Technology Co., Ltd. (hereinafter referred to as Weiteng Semiconductor) was awarded the Annual Technology Breakthrough Award.
This award is intended to recognize groundbreaking, original technological innovations in cutting-edge fields achieved in 2025, reaching international Advanced/leading level, which may yield significant economic and social benefits in the future and play a crucial role in promoting the independent, secure, and controllable development of China’s integrated circuit industry chain. a company of great significance. The organizing committee evaluated candidates based on three criteria: the originality of the technology, the key performance metrics and specifications of the technology or product, and the product’s market prospects as well as its economic and social benefits. Ultimately, Weiteng Semiconductor stood out among numerous nominees to win this award.
Weiteng Semiconductor, founded in 2020, From its very inception, the company has been driven by a clear mission: to achieve domestic self-reliance and high-end substitution in the field of precision cutting, an area long dominated by international giants. The company integrates R&D, manufacturing, and sales, dedicated to providing customers with professional services that encompass high-precision cutting blades, cutting tapes, and end-to-end solutions, thereby helping downstream enterprises enhance cutting quality and optimize production costs.
This strategic positioning quickly resonated with the market. In 2023, with the completion and commissioning of a semiconductor-specific materials project representing a total investment of tens of millions of yuan, Weiteng Semiconductor expanded its facilities by constructing 34,000 square meters of new factory buildings and ancillary spaces, boosting its annual wafer dicing blade production capacity to over one million wafers and placing it among the top players nationwide in terms of scale. More importantly, the company has now accumulated 31 patented technologies and achieved outstanding results in numerous national, provincial, and municipal science-and-technology and entrepreneurship competitions, thereby solidifying its industry leadership through its innovative strength.
Core technology is the decisive edge that enables Weiteng Semiconductor to break through. Its successfully developed “Ultra-Thin Wafer Dicing Blade” project has reduced blade thickness to below 9 microns, bringing product quality in line with the international cutting edge. As a result, Weiteng Semiconductor has become the first domestic company capable of mass-producing ultra-thin blades at this level, thereby breaking the technological monopoly held by foreign manufacturers.
The “Electroforming Hard Cutting Tools” product series for which Weiteng Semiconductor has submitted this award nomination is a concentrated embodiment of its technological prowess. This product series is designed to balance versatility and specialization: the general-purpose models are compatible with a wide range of base materials, including silicon, ceramics, and glass, while the specialized models are tailored to the unique dicing requirements of third-generation compound semiconductors such as gallium arsenide. Notably, the DZY model employs a proprietary monolithic molding process that integrates the dicing blade with an aluminum alloy flange into a single unit, delivering superior structural precision and stability. This design enables highly efficient and precise grooving and cutting operations on a variety of hard, brittle materials.
The outstanding performance of Weiteng Semiconductor’s “electroformed hard cutting tools” stems from three core breakthroughs in materials science and manufacturing processes: Ultrafine grinding Material homogenization and dispersion technology, ultra-high-strength matrix material technology, and quantitative, controllable diamond exposure technology.
Weiteng Semiconductor’s product capabilities have been validated through direct comparisons with leading international peers. Compared with the industry leader, Japan’s Disco Corporation, whose blades achieve a minimum dicing width of 10 microns, Weiteng Semiconductor’s blades can now stably deliver an even narrower dicing width of 9 microns, giving it a clear advantage in terms of process precision.
Notably, Weiteng Semiconductor’s robust product capabilities have earned widespread market recognition. Currently, Weiteng Semiconductor’s customer base spans packaging and testing, Optical communication It has become a trusted supplier to numerous leading domestic and international customers across multiple high-tech sectors, including smart healthcare and LED chips. This milestone signifies that its products have not only achieved domestic substitution but have also integrated into the global high-end semiconductor manufacturing ecosystem thanks to their superior performance and exceptional reliability.
The IC Power List spotlights leading Chinese integrated circuit companies that demonstrate exceptional business acumen in the context of the new era. Drawing on robust, multi-dimensional data from market sources, academia and research institutions, investors, and brand reputation, the list adheres to the principles of objectivity, authenticity, fairness, transparency, and broad inclusiveness. Through an open nomination process, voluntary submissions, and expert evaluation, it rigorously identifies and honors the industry’s outstanding individuals, institutions, enterprises, and brands of the year—thereby setting benchmarks, illuminating the industry landscape, unleashing corporate innovation potential, and fostering a fertile environment for industrial innovation. With an open, international perspective and scientifically grounded selection criteria, the IC Power List empowers semiconductor firms to drive innovation, earning widespread recognition and favor from both businesses and the market. It has now become a leading benchmark award in China’s IC industry. Looking ahead, the IC Power List will continue to serve as a guiding force, providing strong support and impetus for the high-quality development of China’s semiconductor sector.
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Weiteng Semiconductor
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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