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Cutting Plan
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We focus on and constantly innovate to provide customers with high-precision cutting system solutions, committed to helping customers and improving industry competitiveness.
We focus on and constantly innovate to provide customers with high-precision cutting system solutions, committed to helping customers and improving industry competitiveness.
We focus on and constantly innovate to provide customers with high-precision cutting system solutions, committed to helping customers and improving industry competitiveness.
Wafer level high-precision
cutting blades
01
The DZY wafer dicing blade is mainly used for high-precision cutting of wafers to meet the high requirements for cutting accuracy and efficiency in semiconductor packaging processes.
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02
DZR cutting blades are widely used in industries such as semiconductors, optical communications, and new functional materials, providing efficient and stable cutting solutions for these industries.
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03
DZR-S Series Slotted dicing blade
The DZR-S slotted blade has a wide range of applications in semiconductor wafer cutting, functional ceramic cutting, alloy material cutting, and semiconductor packaging component cutting.
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04
During the cutting process, the metal dicing blade is driven by the spindle to rotate at high speed, utilizing the sharpness and hardness of the blade to remove metal materials.
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05
Resin dicing blade is a high-performance, high-precision professional cutting tool with a wide range of applications and significant performance advantages.
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06
UV adhesive tape is a special type of tape that has strong adhesion under normal conditions, but its adhesion decreases sharply after exposure to ultraviolet (UV) light.
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WINTIME Semiconductor
WINTIME Semiconductor, established in Nantong, Jiangsu in 2021, is a high-tech enterprise specializing in the research, development, production, and sales of wafer-level high-precision cutting blades. We provide customers with comprehensive solutions for the entire high-precision cutting process, assisting in enhancing cutting quality and reducing production costs. Recognized by numerous leading enterprises both domestically and internationally, we are a supplier of high-precision cutting blades, cutting tapes, and cutting solutions.
The company was established in
Plant area
have patented technology
WINTIME our strength
Technical process
Ultra-thin blade thickness within 9 microns
The annual production capacity of dicing blade exceeds 1 million pieces, ranking first in the country. The company has developed and completed the "ultra-thin wafer dicing dicing blade" project, which has achieved an ultra-thin thickness of less than 9 microns in technology, and the product quality has reached the international cutting-edge level. It is currently one of the few domestic enterprises that can achieve mass production.
Ultra-thin thickness up to 9 microns
Annual production of dicing blade
Learn about the latest Weiteng
Information dynamics
On March 27, SEMICON CHINA 2026 successfully concluded at the Shanghai New International Expo Center. During the event, Weiteng Semiconductor showcased its full range of wafer dicing products and innovative solutions at Booth 3236 in Hall N3, alongside more than 1,500 exhibitors from around the world, attracting strong interest and yielding substantial results.
2026-04-01
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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