WINTIME Semiconductor Technology Co., Ltd.
WINTIME Semiconductor, established in Nantong, Jiangsu in 2021, is a high-tech enterprise specializing in the research, development, production, and sales of wafer-level high-precision cutting blades. We provide customers with comprehensive solutions for the entire high-precision cutting process, assisting in enhancing cutting quality and reducing production costs. Recognized by numerous leading enterprises both domestically and internationally, we are a supplier of high-precision cutting blades, cutting tapes, and cutting solutions.
In 2023, the total investment in the dedicated material project of WINTIME Semiconductor in Nantong exceeded 100 million yuan, with the construction of a new factory building and auxiliary rooms covering an area of 34,000 square meters. The annual production capacity of dicing blades exceeded 1 million pieces, ranking among the top in the country. The company holds 31 patented technologies, has achieved excellent results in national, provincial, and municipal science and technology competitions and entrepreneurship contests, and has been successfully recognized as a specialized, refined, unique, and innovative enterprise in Jiangsu Province. The company's completed "ultra-thin wafer dicing blade" project has achieved ultra-thin thickness within 9 microns in terms of craftsmanship, and the product quality has reached first-class level. It is currently the only enterprise in China that can achieve mass production. As a domestically developed project, we are committed to the localization substitution of high-end industries while ensuring technological advancement.
WINTIME Semiconductor was founded in
Plant area
have patented technology
Technically achieve ultra-thin thickness within 9 microns
Leadership Concern
Development History
Development History
2020
December 21st
A project team with Mr. Zhu Kaihua as the core member has been established. The company headquarters is located in Ruoqiao City,antong City, Jiangsu Province. It is a high-tech enterprise integrating the research and development, production, and sales of high-precision wafer-level cutting blades It specializes in providing supporting products and services for the precise cutting process in the semiconductor, optical communication, and new functional materials industries.
2021
Wintime Semiconductor Factory has settled in Rugao City and has begun in-depth technical research and development, as well as product production and application The company team has made significant breakthroughs in the fields of semiconductor equipment, materials, and processes, developing a high-precision ultra-thin wafer-level dicing, filling the domestic gap in the application of ultra-narrow cutting lanes on wafers.
2022
June 30th
Wintime Semiconductor completed a new round of equity financing, led by Yida Capital, with Zhonggao and Hefei Industrial Investment following up, raising tens of millions of yuan. The company continues to carry out product research and development and technological upgrades, among which theZY type dicing saw has achieved a thickness of less than 9 microns, and the product performance has reached the advanced level of foreign similar products.
November 18th
Wintime Semiconductor was selected as a high-tech enterprise for its performance in the field of technological innovation and was successfully listed on the provincial small and-sized enterprise platform.
2023
Wintime Semiconductor has reached nearly 100 employees, and the company has further expanded its international market, with the annual sales of its business exceeding ten million that year.
The Nantong Wintime Semiconductor Special Materials Project held a groundbreaking ceremony, with a planned total investment of 240 yuan, and the construction of 34,000 square meters of new factory buildings and ancillary buildings. It is expected that the project will be fully by 2026, with an annual output of 1 million pieces of wafer-level dicing saws.
2024
Wintime Semiconductor has achieved outstanding performance in terms of technological innovation, product research and development, and market application, realizing a doubling of performance for consecutive years; it has been awarded the honorary title of "Small and Medium-sized Innovative Enterprise"; in the same year, the new factory was put into use, with equipment and high-standard workshops as a guarantee, and with continuous high investment in research and development as a support, Wintime's dicing saw has embarked on a journey.
2025
Weiteng Semiconductor will continue to drive development through high-quality innovation, deepen strategic partnerships with China's top wafer and packaging/testing manufacturers, and solidify its leading position in optical communication applications. The company’s revenue will maintain rapid growth of over 50%, while also achieving remarkable results on the paths of technological deepening and digital transformation: it has been publicly recognized as a “Provincial Specialized, Fine, and New Enterprise,” awarded the title of “Young Eagle Enterprise,” completed the certification for “Integration of Informatization and Industrialization,” and earned the qualification of “Three-Star Cloud Adoption” enterprise.
Corporate Culture
Enterprise Culture
Mission, Vision, Values
Mission
Concentrate on focus and continuous innovation, so that the infinite possibilities of semiconductor technology are within reach.
Vision
The most professional and trusted partner in the field of precision cutting.
Values
Work hard and live with love.
Administrative Area
WINTIME Office Area