Weiteng Semiconductor

Search product keywords such as: dicing blade, metal dicing blade, resin dicing blade, UV film and other keywords search

搜索历史清除全部记录
最多显示8条历史搜索记录噢~
All
  • All
  • Product Management
  • News
  • Introduction
  • Enterprise outlets
  • FAQ
  • Enterprise Video
  • Enterprise Atlas

Patent Introduction

Nantong WINTIME Semiconductor Technology Co., Ltd. has always attached great importance to technological innovation and intellectual property protection. Up to now, the company has 31 patent information, covering a variety of technologies and applications of wafer cutting blades. Among them, the company's independent research and development project "ultra-thin wafer dicing blade" has reached an ultra-thin thickness of less than 9 microns in process, and the product quality has reached the international first-class level. In addition, the company is actively applying for more patents to protect its technological achievements and core competitiveness.

Picture Name
9 microns

Ultra-thin thickness up to 9 microns

Picture Name
1 million pieces

Annual production of dicing blade

Picture Name

Digital Transformation Management System Certification

Two-Integration Certification

Environmental Management System Certification Certificate

Occupational Health and Safety Management System Certification Certificate

National Outstanding Entrepreneurship Program

Three-star cloud enterprises

High-tech enterprises

Award of Excellence in Advanced Manufacturing in the Sixth “China Wings of Entrepreneurship” Competition

"Entrepreneurship Jiangsu" and the Science and Technology Entrepreneurship Competition

Quality management system certification certificate

24/2000 The 11th China Innovation and Entrepreneurship Competition

Outstanding Enterprises of the 11th China Innovation and Entrepreneurship Competition (Growth Group)

< 123 >
Weiteng Semiconductor

Powered by www.300.cn  | Label |

Business License