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Cutting Plan
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Weiteng Semiconductor: Using "skills on the tip of the knife" to open up a new track for high-precision cutting of domestic wafers
Release time:
2025-12-17
Weiteng Semiconductor: Using "skills on the tip of the knife" to open up a new track for high-precision cutting of domestic wafers
[Editor's Note] Since its launch in 2020, the IC Billboard has become an annual event in the semiconductor industry.This year has been further expanded and upgraded, with a total of 73 major awards in three categories, covering nine core areas: investment, listed companies, markets, AI, embodied intelligence, workplace, intellectual property, automobiles, and overseas markets, to fully tap the benchmarking power of various tracks in the semiconductor industry.The judging panel consists of more than 100 members of the Semiconductor Investment Alliance and 500+ industry CEOs.The winners will be announced at the 2026 Semiconductor Investment Annual Conference and IC Awards Ceremony.
[Candidate Company] Nantong Weiteng Semiconductor Technology Co., Ltd. (referred to as: Weiteng Semiconductor)
[Candidate Award] Annual Technology Breakthrough Award
Today, as the global semiconductor industry chain is developing toward refinement and extremes, a Chinese company that has only been established for four years is focusing on a segmented but crucial link - wafer-level high-precision cutting.It is Nantong Weiteng Semiconductor Technology Co., Ltd. (hereinafter referred to as "Weiteng Semiconductor").With its ultimate pursuit of "knife-edge technology" and hard-core innovation, Weiteng Semiconductor has not only achieved a breakthrough in the localization of key consumables, but also demonstrated to the world the profound potential of China's intelligent manufacturing in the field of high-end semiconductor special materials with its world's first "sub-nanometer blade".
Founded in 2020, Weiteng Semiconductor has had a clear mission since its birth: to achieve domestic independence and high-end substitution in high-precision cutting, a field that has long been dominated by international giants.The company integrates R&D, production and sales, and is committed to providing customers with professional services covering high-precision cutting blades, cutting tapes and full-process solutions, helping downstream companies improve cutting quality and optimize production costs.
This strategic positioning quickly received market response.In 2023, with the completion and commissioning of the Nantong special materials project with a total investment of tens of millions of yuan, Weiteng Semiconductor has built a new factory and ancillary buildings of 34,000 square meters. The annual production capacity of dicing blades has jumped to more than 1 million pieces, ranking among the top in the country.More importantly, the company has accumulated 29 patented technologies and has achieved good results in a number of national, provincial and municipal science and technology and entrepreneurship competitions, establishing its industry position with its innovative strength.
Core technology is the sharp edge for Weiteng Semiconductor to break through.The "ultra-thin wafer dicing blade" project it has completed research and development has successfully advanced the blade process thickness to within 9 microns, and the product quality has reached the international cutting-edge level.This makes Weiteng one of the few domestic companies that can achieve mass production of ultra-thin blades of this level, breaking the technology monopoly of foreign manufacturers.
The "electroforming hard knife" series of products that applied for the award this time are a concentrated expression of its technical strength.This series of products is designed with both versatility and professionalism: the universal type can be adapted to a variety of basic materials such as silicon, ceramics, glass, etc.; the special type is designed to meet the special cutting needs of third-generation compound semiconductors such as gallium arsenide.Among them, the DZY product adopts a unique one-piece molding process, which combines the dicing blade and the aluminum alloy flange into one, achieving higher structural accuracy and stability, and can
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Weiteng Semiconductor
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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