Weiteng Semiconductor

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Patent Introduction

Nantong WINTIME Semiconductor Technology Co., Ltd. has always attached great importance to technological innovation and intellectual property protection. Up to now, the company has 31 patent information, covering a variety of technologies and applications of wafer cutting blades. Among them, the company's independent research and development project "ultra-thin wafer dicing blade" has reached an ultra-thin thickness of less than 9 microns in process, and the product quality has reached the international first-class level. In addition, the company is actively applying for more patents to protect its technological achievements and core competitiveness.

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9 microns

Ultra-thin thickness up to 9 microns

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1 million pieces

Annual production of dicing blade

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First Prize in the Wuxi Industry Competition of the Entrepreneurship Competition

Rugao City 7th "Dream Star" Agricultural Commercial Bank Entrepreneurship Competition Second Prize

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Weiteng Semiconductor

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