Weiteng Semiconductor

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Patent Introduction

Nantong WINTIME Semiconductor Technology Co., Ltd. has always attached great importance to technological innovation and intellectual property protection. Up to now, the company has 29 patent information, covering a variety of technologies and applications of wafer cutting blades. Among them, the company's independent research and development project "ultra-thin wafer dicing blade" has reached an ultra-thin thickness of less than 10 microns in process, and the product quality has reached the international first-class level. In addition, the company is actively applying for more patents to protect its technological achievements and core competitiveness.

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10 microns

Ultra-thin thickness up to 10 microns

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1 million pieces

Annual production of dicing blade

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2023 Rugao City "Chuang·Youth" Youth Innovation and Entrepreneurship Competition First Prize

Tongchuanghui First Prize

Second Prize in the 7th Longhua District Entrepreneurship Competition, Suzhou External Competition.

The 12th Rugao Youth May Fourth Medal Nomination Award

Third Prize of the 10th "Entrepreneurship Jiangsu" Technology Entrepreneurship Competition

First Prize in the Wuxi Industry Competition of the Entrepreneurship Competition

Rugao City 7th "Dream Star" Agricultural Commercial Bank Entrepreneurship Competition Second Prize

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Weiteng Semiconductor

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