Weiteng Semiconductor

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Patent Introduction

Nantong WINTIME Semiconductor Technology Co., Ltd. has always attached great importance to technological innovation and intellectual property protection. Up to now, the company has 31 patent information, covering a variety of technologies and applications of wafer cutting blades. Among them, the company's independent research and development project "ultra-thin wafer dicing blade" has reached an ultra-thin thickness of less than 9 microns in process, and the product quality has reached the international first-class level. In addition, the company is actively applying for more patents to protect its technological achievements and core competitiveness.

Picture Name
9 microns

Ultra-thin thickness up to 9 microns

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1 million pieces

Annual production of dicing blade

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10th “Maker China” Jiangsu Province SME Innovation and Entrepreneurship Competition – Excellence Award

Certificate of Honor for “Top 100 Projects”

Second prize in the Longhua District Innovation and Entrepreneurship Competition

The 11th China Innovation and Entrepreneurship Competition

Jiangsu Hetong Innovation and Entrepreneurship Talent Competition

Second Prize in the Growth Group at the National Finals of the 5th Tianjin University "Haitang Cup" Alumni Innovation and Entrepreneurship Competition.

"Chuangshang Jiangsu" Provincial Finals of the Innovation and Entrepreneurship Competition for College Graduates and Young Talents - Third Prize in the Project Competition

2023 Rugao City "Chuang·Youth" Youth Innovation and Entrepreneurship Competition First Prize

Tongchuanghui First Prize

Second Prize in the 7th Longhua District Entrepreneurship Competition, Suzhou External Competition.

The 12th Rugao Youth May Fourth Medal Nomination Award

Third Prize of the 10th "Entrepreneurship Jiangsu" Technology Entrepreneurship Competition

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Weiteng Semiconductor

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