Search product keywords such as: dicing blade, metal dicing blade, resin dicing blade, UV film and other keywords search

搜索历史清除全部记录

最多显示8条历史搜索记录噢~

All

All
Product Management
News
Introduction
Enterprise outlets
FAQ
Enterprise Video
Enterprise Atlas

Home page

Description

- Commodity name: 580μm thick DFN package substrate
Use blade:
1A8 58*0.3*40 B N33265 SDC325DZ20240802
Cutting parameters
1. Speed 30000rpm
2. Feed rate 40mm/s
3. Blade height 0.1mm
Bottom film A15020-12C

Post-cutting effect picture

Weiteng Semiconductor

1.4mm thick BGA package substrate

None

product

Digital business card

WINTIME Semiconductor Technology Co., Ltd.

Telephone：+86-513-87886889

Mobile：+86-13851530812

E-mail:shenxiangfei@ntwintime.com

Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

Quick Navigation:

Website QR code

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

Business License