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Description

- Commodity name: 1.4mm thick BGA package substrate
Use blade:
M1A832 SD320N75M23 58X0.21X40
Cutting parameters
1. Speed 30000rpm
2. Feed rate 100mm/s
3. Blade height 0.1mm
Bottom film A15020-12C

Post-cutting effect picture

Weiteng Semiconductor

700μm thick ceramic packaging substrate

580μm thick DFN package substrate

product

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WINTIME Semiconductor Technology Co., Ltd.

Telephone：+86-513-87886889

Mobile：+86-13851530812

E-mail:shenxiangfei@ntwintime.com

Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

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