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Description

Commodity name: Ceramic grinding wheel

A porous ceramic bond is used to securely hold the abrasive grains, enabling high-quality lapping and polishing of materials such as SiC wafers and silicon wafers. The porous ceramic bond exhibits excellent chip evacuation and coolant delivery capabilities, allowing surface roughness levels close to those achieved in polishing.
Applications: Thinning and lapping of materials such as SiC wafers, silicon wafers, and compound semiconductor wafers.
Features: 1. High machining quality, capable of achieving surface roughness close to that of polishing; 2. Porous ceramic bond, providing stable grinding performance.
3. Excellent wear resistance and long service life;
4. A wide variety of products.
Technical Specifications:
ML-V-SD6000-VK01-100 203Dx3Wx7Tx28S

Machine Learning	V	SD	6000	VK01	100	203D	3W	7T	28S
	Binder Type	Abrasive particle types	Particle size	Binder	Concentration	Grinding wheel diameter	Grinding wheel tooth width	Grinding wheel tooth height	Number of grinding wheel teeth
	M-metal bond	SD - Synthetic Diamond	2000#
	B-Resin Binder V-ceramic bond	SDC-Coated Diamond	3000# 4000# 6000#
			8000#
			10,000#
			12,000# 15,000#

Weiteng Semiconductor

Resin grinding wheel

None

product

Digital business card

WINTIME Semiconductor Technology Co., Ltd.

Telephone：+86-513-87886889

Mobile：+86-13851530812

E-mail:shenxiangfei@ntwintime.com

Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province

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