Weiteng Semiconductor

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    • Commodity name: Resin grinding wheel

    By employing a novel resin powder as the binder, highly efficient and high-quality grinding of materials such as silicon wafers and glass substrates is achieved. This approach significantly enhances the surface smoothness of the workpiece, eliminates the need for in-process dressing, and enables stable, continuous machining.
    Applications: Planarization and thinning of hard, brittle materials such as silicon wafers and glass substrates.
    Features: 1. High processing quality;
    2. Excellent sharpness; no need for regrinding during machining;
    3. Grinding wheels for rough, medium, and fine grinding can be provided according to application requirements.
    Technical Specifications
    ML-B-SD2000-BJ01-100 203Dx3Wx7Tx28S

    Major League Baseball SD 2000 BJ01 100 203D 3W7T 28S
    Binder Type Abrasive particle types Particle size Binder Concentration Grinding wheel diameter Grinding wheel tooth width, grinding wheel tooth height Number of grinding wheel teeth
    M-metal bond SD - Synthetic Diamond 320#          
    B-Resin Binder SDC-Coated Diamond 600#          
    V-ceramic bond   800#          
        1200#          
        1500#          
        2000#          
        3000#          
        4000#          

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