Weiteng Semiconductor

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30

2025-08

Leadership Inspection | Wang Chunhua, Member of the Standing Committee of the Rugao Municipal Party Committee and Secretary of the Political and Legal Committee, Visits Weiteng Semiconductor for Research and Guidance

Recently, Wang Chunhua, a member of the Standing Committee of the Rugao Municipal Party Committee and Secretary of the Political and Legal Affairs Commission, visited Weiteng Semiconductor to conduct an inspection and provide guidance. Zhu Kaihua, Chairman of the company, delivered a detailed report on the company’s development journey, business strategy, achievements in technological innovation, and future plans.

2025-08-30

14

2025-08

Leadership Inspection | Municipal Party Committee Organization Department Conducts Research at Weiteng Semiconductor

On August 13, 2025, the Third Research Group of the Municipal Party Committee Organization Department visited Nantong Weiteng Semiconductor Technology Co., Ltd. to conduct a research visit.

2025-08-14

10

2025-07

Leaders’ Inspection | Wu Xinming, Secretary of the CPC Nantong Municipal Committee, Leads a Delegation to Visit Weiteng Semiconductor and Other Sites for Research

Yesterday afternoon (July 9), Wu Xinming, Secretary of the CPC Nantong Municipal Committee, conducted a research visit to Rugao. He emphasized the need to thoroughly study and implement the spirit of General Secretary Xi Jinping’s important speeches on Jiangsu’s work, conscientiously carry out the relevant decisions and arrangements of the provincial and municipal Party committees, courageously shoulder our mission, pursue practical results and strive for excellence, and make solid progress in key tasks such as project construction and rural revitalization, so as to vigorously open up a new chapter in high-quality development at the county level. Ren Xinfeng, a leader of Nantong City, and Wang Minghao, Secretary of the CPC Rugao Municipal Committee and Mayor of Rugao, accompanied the inspection.

2025-07-10

18

2025-06

Ultra-Thin Wafer Dicing Blades: The Critical Cutting Tool in Semiconductor Manufacturing

In today’s era of rapid technological advancement, semiconductors—the backbone of modern electronic devices—have seen every breakthrough in their manufacturing processes attract intense attention. Within the semiconductor fabrication workflow, there is one seemingly small yet critically important step: wafer dicing. At the heart of this process lies the ultra-thin wafer dicing blade, which plays an indispensable role. Today, let us delve into this “secret weapon” of semiconductor manufacturing.

2025-06-18

Weiteng Semiconductor

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