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Cutting Plan
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- Description
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- Commodity name: Glass Powder for Passivation Protection of WT Series Chips
The WT series glass powders are high-performance lead-based glass passivation materials specifically developed for the passivation and protection of various semiconductor chips. Based on the classic PbO–SiO₂–Al₂O₃ system, this product leverages innovative compositional design and precise process control to achieve perfect thermal matching with silicon-based chips while fully exploiting the advantages of lead-containing glass in terms of low-temperature fluidity, wettability, and high dielectric strength. Through a systematic production and application management framework, we ensure that the product not only meets the highest performance requirements but also complies with global environmental regulations and safety standards, thereby providing customers with a passivation and protection material option that delivers outstanding performance, exceptional reliability, and comprehensive regulatory compliance.
Product Description and Core Advantages
Mature system, outstanding performance
The WT series of glass powders is developed based on the classic PbO–SiO₂–Al₂O₃ system. This product exhibits outstanding low-temperature meltability and a broad sintering process window, enabling the glass slurry to flow fully and densify at relatively low temperatures. Moreover, the introduction of lead components imparts exceptional wettability and interfacial adhesion to silicon, ceramics, and various metal frames in the molten state, which is critical for forming robust, defect-free passivation protection structures.
2. Precise thermal matching to eliminate the risk of warping
Leveraging our proprietary formulation and process-control technology, we have achieved revolutionary precision in controlling the coefficient of thermal expansion (CTE) within this mature system. The CTE of our products can be stably maintained within a narrow range of 3.6–4.5 × 10⁻⁶/°C. This “thermal compatibility” achieved at the material-source level fundamentally eliminates reliability issues such as warping and cracking of passivation layers caused by CTE mismatch, making it particularly well suited for passivation processes used in large-size, high-power chips.
3. Reliable Electrical Protection and Process Tolerance
Outstanding Passivation and Insulation: The sintered glass layer is dense and pore-free, exhibiting an exceptionally high volume resistivity (>10¹⁴ Ω·cm) as well as excellent moisture resistance and ion-migration resistance, thereby providing long-lasting physical isolation and electrical protection for the chip.
Outstanding process adaptability: The product features an optimized softening point and rheological properties, exhibits excellent compatibility with a wide range of organic carriers, and is perfectly suited to mainstream processes such as screen printing, blade coating, and photoresist application, thereby providing customers with exceptional flexibility and process tolerance in production.Professional compliance and security management support
We are acutely aware of the special responsibilities associated with lead-containing materials. Therefore, we not only ensure that our products comply with the stringent requirements of the RoHS Directive exemptions and other relevant regulations, but also commit to providing customers with end-to-end professional support across the entire supply chain:
Supply Chain Transparency: Provides complete material composition information and Material Safety Data Sheets (MSDS) to ensure traceability.
User Guidance: A detailed “Safety Operation and Waste Disposal Guide for Lead-Containing Materials” is included, covering best practices across all stages—production, processing, and recycling.
Scrap disposal solutions: We can assist clients in connecting with professional hazardous waste treatment providers or qualified resource recycling organizations to ensure a closed-loop, environmentally compliant process.
Physical Properties and Technology1. Particle Size: The particle size of glass powder typically ranges from 2.5 µm to 30 µm, and products with customized particle sizes can also be manufactured to meet specific customer requirements.
2. Loss on ignition: The loss on ignition is less than 1%, ensuring the product’s stability and reliability at high temperatures.
3. Density: between 3.5 and 6.2 g/cm³.
4. Water Absorption: Glass powder exhibits low water absorption, ensuring its stability in humid environments.
5. pH: The pH typically ranges from 6 to 8, meeting environmental protection requirements.Technical Specifications
Parameters WT-200S WT-230S Average particle size (D50) 5.2 μm 5.6 μm Density 3.82 g/cm³ 3.56 g/cm³ Softening Temperature (Ts) 780°C 830°C Glass transition temperature (Tg) 595°C 610°C Coefficient of thermal expansion (25–720°C) 44 × 10⁻⁷/°C 41 × 10⁻⁷/°C Moisture content ≤0.1% ≤0.1% Purity ≥99.99% ≥99.99% Volume resistivity ≥ 1 × 10¹⁴ Ω·cm ≥ 1 × 10¹⁴ Ω·cm Note: We offer customized optimization of key parameters such as CTE, Tg, and Ts, tailored to your specific passivation structure (e.g., chip size, substrate material) and application process.
Application Guide
Slurry preparation: It is recommended to use our validated high-purity organic carrier and mix and disperse the slurry at a solids content of 65–75% to achieve optimal printing and leveling performance.
Sintering Process: We recommend a step-wise heating profile, with the peak temperature set 20–50°C above the target sintering temperature (Ts). Crucially, a controlled, slow cooling regimen—ideally at a rate of no more than 3°C/min—must be implemented after sintering to maximize the relief of interfacial thermal stresses and ensure zero warpage. Technical Support: Our team of application engineers provides end-to-end, in-depth support across the entire process—from slurry formulation and process-window optimization to reliability testing—helping customers achieve rapid and smooth volume production ramp-up.
Weiteng Semiconductor
WINTIME Semiconductor Technology Co., Ltd.
Telephone：+86-513-87886889
Mobile：+86-13851530812
E-mail:shenxiangfei@ntwintime.com
Address: No. 868, Fushou East Road, Rugao City, Jiangsu Province
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